Transaction card having internal lighting

ABSTRACT

A transaction card construction and a method for making a transaction card are described. The transaction card construction comprises an inlay component and a housing component. The inlay component may comprise a light-penetrable layer and a backer layer. A light source may be disposed on or in the housing component, and the housing component and the inlay component may be joined such that light emitted by the light source passes through the inlay component.

RELATED APPLICATIONS

This application claims priority to U.S. Provisional Patent ApplicationNo. 62/432,154, filed Dec. 9, 2016. The contents of that application arehereby incorporated by reference in their entirety.

DESCRIPTION Technical Field

The disclosed embodiments generally relate to transaction cards, andmore particularly, to transaction cards having internal lighting.

Background

Transaction cards, such as credit and debit cards, have become a primarymeans for individuals to complete transactions involving data exchange.Traditional transaction cards are constructed in a sheeted laminatepress. The shape of the card is die cut and then the card ispersonalized. Typically, transaction cards are cut from laminated sheetsof polyvinyl chloride (PVC) or polycarbonate (PC), or other similarmaterials. After the overall shape of the card is formed, the card maybe modified to add functional and/or visual features. For example, amagnetic strip and/or microchip may be affixed to one side, the card maybe stamped with the card number and customer name, and color or a designmay be added for appearance.

In addition, as transaction cards increase in prevalence, expectationsfor transaction card quality have increased. Transaction cards haveincreasingly been made to meet higher standards regarding materials,durability, security, and appearance. Further, traditional cardmanufacturing methods, which have employed limited card constructiontechniques and materials, continue to utilize techniques and materialsthat restrict variations in card style and appearance.

The present disclosure is directed to improvements in transaction cards.

SUMMARY

The disclosed embodiments relate to a transaction card and aprocess/method for constructing the transaction card, wherein thetransaction card includes an internal light source on or in a housingcomponent.

Consistent with a disclosed embodiment, a transaction card may include ahousing component having a first housing surface, and a second housingsurface opposite the first housing surface. The card may further includea light source disposed on or in the card housing. The card may furtherinclude an inlay component having a first inlay surface, and a secondinlay surface opposite the first inlay surface. The housing and theinlay component may be joined at the first housing surface and thesecond inlay surface such that light emitted by the light source passesthrough the inlay component.

Consistent with another disclosed embodiment, a method/process ofmanufacturing a transaction card may include forming a housing componenthaving a first housing surface, and a second housing surface oppositethe first housing surface. The method may further include providing alight source disposed on or in the housing component. The method mayfurther include forming an inlay component having a first inlay surface,and a second inlay surface opposite the first inlay surface. The methodmay further include joining the housing component and the inlaycomponent at the first housing surface and the second inlay surface suchthat light emitted by the light source passes through the inlaycomponent.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory onlyand are not restrictive of the disclosed embodiments, as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate disclosed embodiments and,together with the description, serve to explain the disclosedembodiments. In the drawings:

FIG. 1 is a block diagram of an exemplary transaction system, consistentwith disclosed embodiments;

FIG. 2A is a front view of an exemplary transaction card, consistentwith disclosed embodiments;

FIG. 2B is a back view of the exemplary transaction card of FIG. 2A,consistent with disclosed embodiments;

FIG. 3 is a front view of an exemplary transaction card showing sectionline 4-4, consistent with disclosed embodiments;

FIG. 4A is a cross-sectional view of the exemplary transaction card ofFIG. 3 along section line 4-4, consistent with disclosed embodiments;

FIG. 4B is another cross-sectional view of the exemplary transactioncard of FIG. 3 along section line 4-4, consistent with disclosedembodiments;

FIG. 5 is an exploded cross-sectional view of an exemplary transactioncard, consistent with disclosed embodiments;

FIG. 6 is another exploded cross-sectional view of an exemplarytransaction card, consistent with disclosed embodiments;

FIG. 7A is a front view of an exemplary transaction card showing sectionline 7B-7B, consistent with disclosed embodiments;

FIG. 7B is an exploded isometric cross-sectional view of the exemplarytransaction card of FIG. 7A taken along section line 7B-7B, consistentwith disclosed embodiments;

FIG. 8 is an exploded cross-sectional view of an exemplary transactioncard, consistent with disclosed embodiments;

FIG. 9 is another exploded cross-sectional view of an exemplarytransaction card, consistent with disclosed embodiments;

FIG. 10 is a schematic illustration of an exemplary electrical circuit,consistent with disclosed embodiments;

FIG. 11A is a front view of an exemplary transaction card showingsection line 11B-11B, consistent with disclosed embodiments;

FIG. 11B is a cross-sectional view of the exemplary transaction card ofFIG. 11A taken along section line 11B-11B, consistent with disclosedembodiments;

FIG. 12 is a front and cross-sectional view illustration of an exemplarytransaction card having a rechargeable power source, and a chargingdevice, consistent with disclosed embodiments; and

FIG. 13 is a flowchart showing an exemplary method for constructing atransaction card, consistent with the disclosed embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to the disclosed embodiments,examples of which are illustrated in the accompanying drawings. Whereverconvenient, the same reference numbers will be used throughout thedrawings to refer to the same or like parts.

The term “transaction card,” as used herein may refer to a physical cardproduct that includes features to provide transaction information. Asused herein, the term “personal information” may include informationthat is associated with a user of the card or information associatedwith an account of/for the card user. In some embodiments, personalinformation may include “transaction information,” such as financialinformation (e.g., card numbers, account numbers, expiration dates,etc.), quasi-financial information (e.g., rewards balance, discountinformation, etc.), individual-identifying information (e.g., name,address, etc.), bank information, and/or transaction networkinformation. Examples of transaction cards include credit cards, debitcards, gift cards, rewards cards, frequent flyer cards,merchant-specific cards, discount cards, identification cards,membership cards, and driver's licenses, but are not limited thereto.The physical properties of the transaction card (e.g., size,flexibility, location of various components included in the card) maymeet the various international standards, including, for example,ISO/IEC 7810, ISO/IEC 7811, ISO/IEC 7812, ISO/IEC 7813, ISO/IEC 7816,ISO 8583, ISO/IEC 4909, and ISO/IEC 14443. For example, a transactioncard may have a dimension of 85.60 mm (width) by 53.98 mm (height) by0.76 mm (thickness), as specified in ISO/IEC 7810.

Disclosed embodiments include transaction cards and methods formanufacturing a transaction card. For example, disclosed embodimentsinclude a transaction card having a housing component configured tohouse an inlay component, wherein the inlay component may include alight-penetrable layer and a backer layer joined to the light-penetrablelayer. A light source or sources may be disposed on or in the housingcomponent, and the housing component and inlay component may be joinedsuch that light emitted by the light source(s) passes through the inlaycomponent.

The light source may be configured to emit light from the card. Forexample, the light source may be positioned on or in the card andconfigured to emit light outwardly or away from the card. In someembodiments, the light source may be configured to emit light through alight-penetrable component of the card. For example, the light sourcemay be configured to emit light for passage through one or moretransparent, translucent, or non-opaque component(s) or subcomponent(s)of the card. The light source may also or alternatively be configured toemit light from a space, cavity, or compartment defined by one or morecomponents or features of the card.

In some embodiments, the light source may be a light emitting diode.Additionally, in some embodiments, the light source may be disposedbetween the first housing surface and the inlay component to permitlight emitted by the light source to pass through the inlay component.

The inlay component may include a light-penetrable layer and a backerlayer joined to the light-penetrable layer. The backer layer may providestructural support to the light-penetrable layer. In some embodiments,the light source may be disposed between the light-penetrable layer andthe backer layer.

The housing component may also include a cavity having a cavity wall. Insome embodiments, the light source may be disposed between the cavitywall and the inlay component.

In some embodiments, the card may further include a switchelectronically connected to the light source. The switch may beconfigured to activate and deactivate the light source.

The card may further include a power source disposed on or in the cardhousing. The power source may be configured to supply power to the lightsource. In some embodiments, the power source may be a rechargeablepower source. In some embodiments, the light source may be a lightemitting diode (LED). In other embodiments, the light source may be aphotoluminescent material.

The light-penetrable layer may comprise transaction information. In someembodiments, the transaction information may be visible to users whenthe light source is activated or when the light source is deactivated.The visibility and/or appearance of the transaction information may beenhanced or modified when the light source is activated.

FIG. 1 illustrates an exemplary transaction system 10. Transactionsystem 10 may include a computing system configured to receive and sendinformation between the components of transaction system 10 andcomponents outside of transaction system 10. Transaction system 10 mayinclude a financial service provider system 12 and a merchant system 14communicating with each other through a network 16. Transaction system10 may include additional and/or alternative components.

Financial service provider system 12 may include one or more computersystems associated with an entity that provides financial services. Forexample, the entity may be a bank, credit union, credit card issuer, orother type of financial service entity that generates, provides,manages, and/or maintains financial service accounts for one or morecustomers. Financial service accounts may include, for example, creditcard accounts, checking accounts, savings accounts, loan accounts,reward accounts, and other types of financial service accounts.Financial service accounts may be associated with physical financialservice transaction cards, such as credit or debit cards that customersuse to perform financial service transactions, such as purchasing goodsand/or services online or at a point of sale (POS) terminal. Financialservice accounts may also be associated with electronic financialproducts and services, such as a digital wallet or similar account thatmay be used to perform electronic transactions, such as purchasing goodsand/or services online.

Merchant system 14 may include one or more computer systems associatedwith a merchant. For example, merchant system 14 may be associated withan entity that provides goods and/or services (e.g., a retail store).The merchant may include brick-and-mortar location(s) that a customermay physically visit and purchase goods and services using thetransaction cards. Such physical locations may include computing devices(e.g., merchant system 14) that perform financial service transactionswith customers (e.g., POS terminal(s), kiosks, etc.). Additionally oralternatively, merchant system 14 may be associated with a merchant whoprovides an electronic shopping environment, such as a website or otheronline platform that consumers may access using a computer through abrowser, a mobile application, or similar software. Merchant system 14may include a client device, such as a laptop computer, desktopcomputer, smart phone, or tablet, which a customer may operate to accessthe electronic shopping mechanism.

Network 16 may include any type of network configured to facilitatecommunications and data exchange between components of transactionsystem 10, such as, for example, financial service provider system 12and merchant system 14. Network 16 may include, but is not limited to,Local Area Networks (LANs) and Wide Area Networks (WANs), such as theInternet. Network 16 may be a single network or a combination ofnetworks. Network 16 is not limited to the above examples andtransaction system 10 may implement any type of network that allowsentities (shown and not shown) of transaction system 10 to exchange dataand information.

Transaction system 10 may be configured to conduct a transaction using atransaction card 20. In some embodiments, financial service providersystem 12 may provide transaction card 20 to a customer for use inconducting transactions associated with a financial service account heldby the customer. For example, the customer may use transaction card 20at a merchant location to make a purchase. During the course of thepurchase, information may be transferred from transaction card 20 tomerchant system 14 (e.g., a point of sale device). Merchant system 14may communicate with financial service provider system 12 via network 16to verify the information and to complete or deny the transaction. Forexample, merchant system 14 may receive account information fromtransaction card 20. Merchant system 14 may transmit the accountinformation and a purchase amount, among other transaction information,to financial service provider system 12. Financial service providersystem 12 may settle the transaction by transferring funds from thecustomer's financial service account to a financial service accountassociated with the merchant.

While transaction system 10 and transaction card 20 are depicted anddescribed in relation to transactions that involve customers, merchants,and financial service providers, it should be understood that theseentities are used only as an example to illustrate one environment inwhich transaction card 20 may be used. Transaction card 20 is notlimited to financial products and may be any physical card product thatis configured to store and/or transmit information. For example,transaction card 20 may be an identification card configured to provideinformation to a device in order to identify the holder of the card(e.g., a driver's license).

In some embodiments, transaction card 20 may further include a datastorage component 22 disposed on or in a transaction card frame(“frame”) 24. As used herein, a “data storage component” may be one ormore devices and/or elements configured to receive, store, process,provide, transfer, send, delete, and/or generate information. Forexample, data storage component 22 may be a microchip (e.g., a Europay,MasterCard, and Visa (EMV) chip), a communication device (e.g., NearField Communication (NFC) antenna, Bluetooth® device, WiFi device), amagnetic strip, a barcode, Quick Response (QR) code, etc. Data storagecomponent 22 may be secured (or affixed, attached) to frame 24 in such away that allows frame 24 to carry data storage component 22 whilemaintaining a utility of data storage component 22 (i.e., allowing datastorage component 22 to interact with merchant system 14). Data storagecomponent 22 may be configured to ensure that data storage component 22functions properly during data storage and transmission; for example,ensuring that a card containing an RFID (radio frequency identification)device shielded by a material layer can still be properly read by anRFID reader through the material layer.

FIGS. 2A and 2B are front and rear views, respectively, of an exemplarytransaction card 28 with a first data storage component 22A (e.g., amicrochip) and a second data storage component 22B. FIG. 2A shows afront surface 30 of card 28 with a length defined as L_(c), and FIG. 2Bshows a rear surface 32 of card 28, with data storage component 22Bexposed (i.e., a magnetic strip in this exemplary embodiment). Themagnetic strip may have a length L_(m) which may be equal to or lessthan the card length L_(c), and may be flush with rear surface 32.

In some embodiments, visual details, such as transaction information,aesthetic designs, images, etc., may be visible from a first side 30 ofcard 28. For example, a customer name, an account number, dateinformation, bank information, transaction system information (e.g.Visa, MasterCard, etc.), a design or logo, a signature associated withthe customer, and/or other information may be visible from first side30. In some embodiments, visual information may also or alternatively bevisible from second side 32 of card 28. Such visual details may begenerated during a process of forming the card (e.g., pressing,laminating, injection molding, etc.) or during a process subsequent tocard formation (e.g., milling, laser cutting, etching, stamping, etc.).In some embodiments, such visual details may be included on one or moresurfaces of transaction card 28 and visible from first and/or secondside 30, 32.

FIG. 3 illustrates card 28 with a section line 4-4 along its length.FIG. 4A is a magnified cross-sectional view of card 28 along line 4-4.As shown, card 28 may include a housing component (or “housing”) 34, aninlay component (or “inlay”) 36, one or more light sources 40, and apower source 42 electronically connected to the light sources 40. Powersource 42 may be configured to supply electrical power to light sources40, which may be configured to emit light through inlay 36. Housing 34and/or inlay 36 may include a recess 44 configured to house and exposedata storage device 22A. As used herein, the term “inlay” may refer tomaterial or a component set into a surface of another material orcomponent.

Housing 34 may be made of PVC, PC, or other similar materials, and maybe manufactured using a molding process, such as an injection-moldingprocess or a compression-molding process. In other embodiments, housing34 may be formed of a resin mixture comprising one or more of athermoplastic elastomer (TPE), polybutylene terephthalate (PBT), anacetal homopolymer, and/or other materials. In some embodiments, the TPEand/or other materials may be selected to provide card 28 with a“soft-touch feel” (i.e., a haptic sensation that occurs when a persontouches something that, for example, feels soft, smooth, and/or satiny).In some embodiments, the resin mixture may include a polyesterelastomer, a block copolymer, a thermoplastic olefin, an elastomericalloy, a thermoplastic polyurethane, a thermoplastic copolyester, or athermoplastic polyamide. In some embodiments, housing 34 may benon-opaque (e.g., translucent, transparent, clear, etc.). That is,housing 34 may be formed of a material that is non-opaque aftermanufacturing is complete (e.g., after setting).

Inlay 36 may be a light-penetrable inlay. That is, inlay 36 may beconfigured to allow light to pass therethrough (i.e., a device throughwhich visible light may pass). In some embodiments, inlay 36 may beclear, transparent, or translucent. In some embodiments, light passingthrough inlay 36 may be diffused to achieve desired aesthetic and/oroperational requirements. That is, inlay 36 may have light-diffusingproperties or be a light-diffusing layer. In some embodiments, inlay 36may be backlit by light sources 40 to produce a desired aestheticappearance of card 28 (e.g., to cause card 28 to appear “lit up” and/orto cause visual details on card 28 to become visible or appeardifferently when backlit or edge lit).

Light diffusing properties of inlay 36 may function to spread lightemitted by light sources 40 across inlay 36 to create a more evendistribution of light intensity, as seen by a card user through inlay36. In this way, desired lighting characteristics may be achieved whilereducing the appearance of localized higher-intensity light (or “hotspots”) caused by light sources 40 (e.g., sources of direct light, suchas LEDs). The light diffusing function of inlay 36 may also permit foredge-lighting of inlay 36 (discussed further below), which may requirefewer light sources 40 than backlighting configurations, therebyreducing the cost of card 28 and improving its operating efficiency.

As shown in FIG. 4A, housing 34 may include a first housing surface 46,and a second housing surface 48 opposite the first housing surface 46.Inlay 36 may include a first inlay surface 50, and a second inlaysurface 52 opposite the first inlay surface 50. Light sources 40 maydisposed on or in card housing 36 and configured to emit light throughinlay 36 (i.e., when energized or powered by power source 42). Housing34 and inlay 36 may be joined via first housing surface 46 and secondinlay surface 52 such that light emitted by light source(s) 40 passesthrough inlay 36. That is, first housing surface 46 and second inlaysurface 52 may be adjacent and/or in contact with one another whenhousing 34 and inlay 36 are joined. For example, housing 34 and inlay 36may be joined using an adhesive material, interconnecting features(e.g., snap fit, tongue and groove, etc.), fasteners (e.g., screws,nuts, bolts, rivets, etc.), and/or other joining mechanisms ortechniques.

Light source 40 may be an electronic, photoluminescent (i.e., “glow inthe dark”), or other type of device configured to emit light. Forexample, in some embodiments, light source 40 may be a light emittingdiode (LED). Suitable LEDs may be selected based on, among otherfactors, size limitations, color requirements, and power usagelimitations. For instance, card 28 may have an overall thickness of0.030 inches (0.762 mm) (e.g., pursuant to ISO standards for transactioncard thickness), and therefore a relatively small LED may be used aslight source 40. For example, LEDs having a footprint of the standardsize 0201 (0.002×0.001×0.001 inches) may be suitable for use in card 28.It is noted that other LEDs of different sizes may be used, depending onthe dimensions of the LED and/or the dimensions of the card components(e.g., housing 34, inlay 36, etc.). It should be noted that light source40 may be or include other types of electronic light sources, such aslight bulbs (e.g., incandescent, fluorescent, halogen, etc.). Size andpower constraints may dictate the types of electronic light sources thatcan be used with card 28 as light source 40.

In other embodiments, photoluminescent materials may be used as lightsource 40. For example, light source 40 may be or include aphotoluminescent coating, such as a photoluminescent epoxy or paint. Inother embodiments, a photoluminescent pigment or other photoluminescentmaterial may be added to inlay 36 during its formation. Suitablephotoluminescent materials may be those that store light photons whenexposed to an external light source (e.g., ambient light, directsunlight, another light source, etc.) and continue to emit light afterexposure to the light source has ended.

When multiple light sources 40 are used, one or more colors of lightsources 40 (i.e., light sources that emit different colors) may beimplemented, depending on design and utility requirements. For example,in some embodiments, light sources 40 may be all the same color (e.g.,red, orange, yellow, green, blue, etc.). In other embodiments, lightsources 40 configured to emit different colors of light may be installedto generate desired patterns of colored light for aesthetic orfunctional purposes. For example, in some embodiments, LEDs of differentcolors may be configured to indicate the voltage or state of charge(SOC) of power source 42. In an exemplary embodiment, an LED of a firstcolor (e.g., green) may be configured to be energized when power source42 is above a first voltage or SOC. An LED of a second color (e.g.,yellow) may be configured to be energized when power source 42 is abovea second and below the first voltage or SOC. An LED of a third color(e.g., red) may be configured to be energized when power source 42 isbelow the second voltage or SOC. It is noted that other types ofinformation may be indicated based on the location, color, flashingpattern, etc., of light sources 40.

In some embodiments, as shown in FIG. 4A, inlay 36 may be comprised of asingle-layer. In other embodiments, inlay 36 may be formed of multiplecomponents (e.g., multiple layers). For example, as shown in FIG. 4B,inlay 36 may include a light-penetrable layer 54 and a backer layer 56(serving as structural backing support for layer 54). Light-penetrablelayer 54 and backer layer 56 may be joined by a suitable joining orfastening mechanism that permits light to pass from second inlay surface52 to first inlay surface 50. For example, Light-penetrable layer 54 andbacker layer 56 may be joined by an adhesive layer (not shown), whichmay be, for example, 1 mil or greater in thickness (depending on theoverall thickness of card 28 and the thicknesses of light-penetrablelayer 54 and backer layer 56, and on the requirements of the adhesive).

In some embodiments, light-penetrable layer 54 may be or include a lightdiffuser material, such as a light diffuser film. For example,light-penetrable layer 54 may be a one- or two-sided diffuser filmconfigured to distribute light evenly across its surface. Eachrespective side of the light diffuser material may be clear,translucent, or have a matte finish. In some embodiments, the lightdiffuser material may comprise multiple layers, such as guide layers,diffusion layers, prism layers, etc.

In other embodiments, light-penetrable layer 54 may be clear,transparent, translucent, tinted, polarized, textured, hazed, colored,or otherwise configured to affect (or not affect) light passingtherethrough. In some embodiments, light-penetrable layer 54 may have areflective backing. That is, light-penetrable layer 54 may be adjacent areflective material, such as a mirror, polished metal, metal-coated ormetal-plated material, a coated or otherwise reflective glass or plasticmaterial, etc. A reflective backing may reflect back light passingthrough light-penetrable layer 54 to enhance or brighten the appearanceof card 28.

The thickness of light-penetrable layer 54 may be selected based ondesired light-altering performance, the thickness of backer layer 56,and/or structural requirements of inlay 34. For example,light-penetrable layer may be from 3 mils (i.e., 3/1000 of an inch) to20 mils thick, depending on the thickness of backer layer 56 and/orother components. Light-penetrable layer 54 may be, for example, from 3to 20 mils, from 3 to 15 mils, from 3 to 10 mils, from 3 to 5 mils, orless than 3 mils thick.

In some embodiments, light-penetrable layer 54 may be formed using alamination, injection molding, compression injection, sheet forming, orother process. In some embodiments, light diffusing materials, such asacrylic, polycarbonate (PC), polyethylene terephthalate (PET), and/orother materials may be used to form light-penetrable layer 54. In otherembodiments, light-penetrable layer 54 may be or include one or morecommercially available materials. For example, light-penetrable layer 54may be cut from a roll or sheet of light-penetrable commerciallyavailable material. Cutting, stamping, milling, laser cutting, and/orother processes may be used to form light-penetrable layer 54 from rollsor sheets of commercially available light-penetrable material.

In some embodiments, light-penetrable layer 54 may be configured topolarize light generated by light source 40 to alter the appearance ofpassing light and/or to provide a privacy function. For example,light-penetrable layer 54 may be configured to restrict the angle atwhich visible light is emitted from inlay 36 (e.g., to reduce visibilityof details on card 28 from peripheral vantage points). To achievepolarizing functionality, light-penetrable layer 54 may, for example,include polarizing materials or a polarizing layer.

Backer layer 56 may be a structural layer configured to supportlight-penetrable layer 54 and facilitate the joining of inlay 36 tohousing 34. In some embodiments, backer layer 56 may be formed ofparticular materials or be sized to improve the mechanical properties ofcard 28. For example, backer layer 56 may be formed of stiffer, lessflexible, and/or more dense materials than light-penetrable layer 54.Backer layer 56 may be formed of, for example, injection molded plastic,polycarbonate, acrylic, and/or other materials. The thickness of backerlayer 56 may be selected based on the overall thickness of card 28(e.g., 30 mils) and may range from 10-20 mils, depending on thethicknesses of housing 34 and light-penetrable layer 54. For example,backer layer 56 may be less than 20 mils, 10-20 mils, 12-18 mils, 14-16mils, 15 mils, or greater than 10 mils in thickness.

With reference to FIG. 5, some embodiments of card 28 may be configuredsuch that light source(s) 40 is/are disposed between housing 34 andinlay 36. For example, FIG. 5 shows a partially disassembled, magnifiedcross-sectional view of card 28, in which light sources 40 are disposedbetween first housing surface 46 and inlay 36 (e.g., second inlaysurface 52 of inlay 36). In embodiments consistent with the example ofFIG. 5, backer layer 56 may be non-opaque (i.e., formed of non-opaquematerial) to permit light to travel through backer layer 56, and thusthrough inlay 36.

In the configuration of the exemplary embodiment of FIG. 5, visualdetails of card 28, such as transaction information (e.g., card number,customer name, logos, etc.), may be included on backer layer 56, whichmay be visible by the user through inlay 36 and/or made more visible (orappear differently) when light source(s) 40 is/are emitting light. Forexample, a top surface 58 of backer layer 56 may be etched, sanded,laser-etched, carved, printed, milled, stamped, or otherwise processedto include visual details that are configured to be or become visiblethrough inlay 36 when light source(s) 40 is/are energized. Inembodiments consistent with the example of FIG. 5, light-penetrablelayer 56 may also or alternatively be processed to include visualdetails.

With reference to FIG. 6, some embodiments of card 28 may be configuredsuch that light source(s) 40 is/are disposed between light-penetrablelayer 54 and backer layer 56. For example, FIG. 6 shows a partiallydisassembled, magnified cross-sectional view of card 28, in which lightsources 40 are disposed between top surface 58 of backer layer 56 and abottom surface 60 of light-penetrable layer 54. In embodimentsconsistent with the example of FIG. 6, backer layer 56 may benon-opaque, opaque, and/or reflective (i.e., is formed of or includesreflective material). For example, top surface 58 of backer layer 56 mayinclude a reflective coating or be covered with a layer of reflectivematerial (e.g., metal, metallic coating, reflective spray or film, etc.)to reflect light through light-penetrable layer 54.

In the configuration of the exemplary embodiment of FIG. 6, visualdetails of card 28, such as transaction information (e.g., card number,customer name, logos, etc.), may be included or formed on or in the topor bottom surface of light-penetrable layer 54 (i.e., on first inlaysurface 50 or bottom surface 60 of light-penetrable layer,respectively). In this way, visual details of card 28 may be visible bythe user through inlay 36 and/or made more visible (or appeardifferently) when light source(s) 40 is/are energized (i.e., emittinglight). Light-penetrable layer 54 may be etched, sanded, laser-etched,carved, printed, milled, stamped, or otherwise processed to includevisual details that are configured to be or become visible through inlay36 when light source(s) 40 is/are energized.

FIG. 7A illustrates card 28 with a section line 7B-7B along its width.FIG. 7B is a magnified, partially disassembled, isometriccross-sectional view of card 28 along line 7B-7B. In embodimentsconsistent with the example of FIG. 7B, housing 34 may include a cavity62 having a cavity wall 64. Inlay 36 may be configured to fit into or bepositioned within cavity 62 such that a side portion 66 of inlay 36(e.g., a side portion of light-penetrable layer 54 and/or backer layer56) is adjacent cavity wall 64. Light source(s) 40 may also bepositioned on or on or in (e.g., recessed into) cavity wall 64. In thisway, light source(s) 40 may be configured to project (i.e., emit) lightlaterally through inlay 36. Laterally projected light from lightsource(s) 40 may be distributed and/or scattered throughout inlay 36 toachieve a more even light distribution across front surface 30 of card28. In other words, light source(s) 40 may be configured to edge-lightinlay 36. Edge-lighting may permit for fewer light sources 40 to beused, thereby reducing the cost and increasing the efficiency of card28.

In some embodiments, as shown in FIGS. 8 and 9, card 28 may include aswitch 68 configured to activate and deactivate the light source(s) 40.With reference to FIG. 8, in some embodiments, switch 68 may be disposedbetween light-penetrable layer 54 and backer layer 56. For example,switch 68 may be disposed in a recess 70 on top surface 58 of backerlayer 56. In other embodiments, switch 68 may be disposed directly ontop surface 56 of backer layer 56 (i.e., not within a recess). Switch 68may be a pressure switch (i.e., a pressure-sensitive orpressure-activated switch) configured to activate light source(s) 40when a user presses on card 28 (e.g., presses inlay 36 and housing 34together). For instance, inlay 36 (i.e., light-penetrable layer 54and/or backer layer 56) may be configured to flex under pressure appliedto card 28, thereby exerting a force on switch 68 sufficient to energizelight source(s) 40. In other embodiments, switch 68 may be a touchsensor (e.g., a capacitive-type touch sensor) positioned at orsufficiently near first inlay surface 50 to detect when a user touchesswitch 68 (i.e. to activate light source(s) 40).

In other embodiment, with reference to FIG. 9, switch 68 may be disposedbetween housing 34 and inlay 36. For example, switch 38 may be disposedbetween first housing surface 46 and the bottom of inlay 36 (e.g.,second inlay surface 52). For example, switch 68 may be disposed inrecess 70 on second inlay surface 52. In other embodiments, switch 68may be disposed directly on second inlay surface 52 (i.e., not within arecess).

FIG. 10 shows a schematic illustration of an exemplary circuit 72consistent with embodiments of the present disclosure. As shown, lightsource 40 may be electrically connected to power source 42 (e.g., viawires, flat wires, printed conductors, a circuit board, etc.). Switch 68may be electrically connected to light source 40 and power source 42,and may be configured to activate and deactivate the light source byconnecting and disconnecting light source 40 from power source 42. Itshould be understood that other circuit components may also be included,such as capacitors, resistors, memory, a processor, etc. Light source 40may include a plurality of light sources (e.g., LEDs) connected inparallel to power source 42 (e.g., by a bus or other conductivecomponent). In other embodiments, one or more light sources may beconnected in series.

In some embodiments, power source 42 may be or include one or morebatteries. For example, power source 42 may include a lithium-ionbattery or other type of non-rechargeable or single-use battery.Batteries used in power source 42 may be thin and flexible. For example,commercially available flexible lithium batteries less than 2 mils thickmay be used. Battery thickness may exceed 2 mils depending on thethickness of card 28 and of its components (e.g., inlay 36 and housing34). The lifespan of a non-rechargeable battery may be determined bytype and quantity of light sources 40 included in card 28.

In another embodiment, with reference to FIGS. 11A-11B, card 28 mayinclude a rechargeable power source 74. FIG. 11A illustrates card 28with a section line 11B-11B along its width. FIG. 11B is a magnifiedcross-sectional view of card 28 along line 11B-11B. In embodimentsconsistent with the example of FIG. 11B, rechargeable power source 74may be disposed on or in housing 34 and configured to supply power tothe light source. Rechargeable power source 74 may be or include, forexample, a lithium polymer battery or other type of rechargeable ormultiple-use battery. Batteries used in rechargeable power source 74 maybe thin and flexible. For example, commercially available flexiblelithium polymer batteries less than 2 mils thick may be used. Batterythickness may exceed 2 mils depending on the thickness of card 28 and ofits components (e.g., inlay 36 and housing 34). Rechargeable battery 74may include charging electrodes 76 configured to conduct an electricalcurrent from a charging device into rechargeable battery 74. Chargingelectrodes 76 may be configured to be exposed, for example, at frontsurface 30 of card 28. In other embodiments, charging electrodes 76 maybe exposed at a rear surface 78 opposite front surface 30.

FIG. 12 shows a schematic illustration of an exemplary charging device80 configured to receive card 28 for charging rechargeable battery 74.In the example of FIG. 12, charging device 80 may be configured toreceive card 28 through an open end 82. A charging terminal 84 may bedisposed on or in charging device 80 and include charging electrodes 86configured to engage charging electrodes 76 of card 28. Charging device80 may include a charging circuit 88 for conditioning electrical currentfrom an external power source. It should be noted that card 28 andcharging device 80 may be configured to utilize other configurations ortypes of charging systems, such as inductive charging systems, solarpower systems (e.g., solar panel or thin-film solar power systems),and/or other types of charging systems.

In some embodiments, card 28 may include an internal power generator tocharge rechargeable battery 74. For example, card 28 may include akinetic generator, such as a micro-generator (e.g., a claw-polegenerator, a lavet generator, an air coil generator, oscillating massgenerator, piezoelectric material generator, etc.). In otherembodiments, card 28 may include a thermoelectric generator, such as asemiconductor-type thermoelectric generator configured to generateelectricity from a temperature gradient. In such embodiments, a user maybe able to place one side of card 28 on a hot or cool surface (relativeto the other side of card 20) to charge battery 74. In otherembodiments, card 28 may include solar panels or thin-film solar cells(e.g., photovoltaic materials) for harvesting solar energy. In someembodiments, light-penetrable layer 54 may comprise a transparentphotovoltaic material configured to convert light energy intoelectricity while also allowing light to pass therethrough.

FIG. 13 is a flowchart showing an exemplary method/process 1300 forforming a transaction card according to some embodiments of the presentdisclosure. It is noted that the steps associated with method 1300 maybe performed in in different orders than the order in which they arenumbered and/or described. Method 1300 may include forming a cardhousing component having a first housing surface, and a second housingsurface opposite the first housing surface (Step 1310). For example Step1310 may include forming housing 34 from PVC, PC, or other similarmaterials, using a manufacturing process, such as a molding process(e.g., an injection-molding process or a compression-molding process).In other embodiments, housing 34 may be formed of a resin mixturecomprising one or more of a thermoplastic elastomer (TPE), polybutyleneterephthalate (PBT), an acetal homopolymer, and/or other materials. Insome embodiments, the TPE and/or other materials may be selected toprovide card 28 with a “soft-touch feel” (i.e., a haptic sensation thatoccurs when a person touches something that, for example, feels soft,smooth, and/or satiny). In some embodiments, method 1310 may includeforming housing 34 from a resin mixture comprising a polyesterelastomer, a block copolymer, a thermoplastic olefin, an elastomericalloy, a thermoplastic polyurethane, a thermoplastic copolyester, or athermoplastic polyamide. In some embodiments, housing 34 may benon-opaque (e.g., translucent, transparent, clear, etc.). That is,housing 34 may be formed of a material that is or becomes non-opaqueafter manufacturing is complete (e.g., after setting)

Method 1300 may further include forming light-penetrable inlay 34 withfirst inlay surface 50 and second inlay surface 52 opposite first inlaysurface 50 (Step 1320). In some embodiments, inlay 34 may be formed as aunitary component, as shown in FIG. 4A, for example, using a moldingprocess, a stamping process, a sheet forming process, or anothermanufacturing process. In other embodiments, Step 1320 may includeforming inlay 34 by forming and joining backer layer 56 andlight-penetrable layer 54. Backer layer 56 and light-penetrable layer 54may each be respectively formed using a molding process, a stampingprocess, a sheet forming process, or another manufacturing process. Step1320 may also include joining backer layer 56 and light-penetrable layer54, for example, using epoxy or a lamination process. In someembodiments, a reflective coating may also be provided on backer layer56 during step 1320 to allow light to be reflected throughlight-penetrable layer 54. In some embodiments, step 1320 may furtherinclude providing visual details of card 28, such as personalinformation, on light-penetrable layer 54 and/or backer layer 56, suchas by etching, sanding, laser-etching, carving, printing, milling,stamping, etc.

As used herein, the term “forming” with regard to steps of forming ormanufacturing components or subcomponents of card 28 may includeproviding such components or subcomponents (e.g., by providingcommercially available or commissioned components).

Method 1300 may further include forming cavity 62 within housing 34(Step 1330). Step 1330 may include forming cavity wall 64. In someembodiments, cavity 62 may be formed when housing 34 is formed (i.e.,formed during the forming process of housing 34). In other embodiments,step 1330 may be a separate process that includes subsequently formingcavity 64 within housing 34, such as by milling, laser cutting, etc.

Method 1300 may further include providing light source 40 and disposingit on or in card housing 34 (Step 1340). In some embodiments, step 1340may include providing an electronic, photoluminescent (i.e., “glow inthe dark”), or other type of device configured to emit light fromhousing 34 (e.g., from cavity 62). For example, in some embodiments,step 1340 may include providing one or more light emitting diodes (LED)or another type of electronic light source, such as an incandescent orfluorescent source. In other embodiments, step 1340 may includeproviding a photoluminescent material, such as a photoluminescentcoating (e.g., a photoluminescent epoxy or paint) on one or more offirst housing surface 46, top surface 58 of backer layer 56, or secondinlay surface 52. Alternatively, a photoluminescent pigment or otherphotoluminescent material may be added to inlay 36 during its formation.In some embodiments, step 1340 may include providing multiple lightsources 40, which may be configured to emit different colors of light.

In some embodiments, with reference to FIG. 5, step 1340 may includeproviding light source(s) 40 between inlay 36 and housing 34 (e.g.,between first housing surface 46 and second inlay surface 52). In otherembodiments, with reference to FIG. 6, step 1340 may include providinglight source(s) between top surface 58 of backer layer 56 and a bottomsurface 60 of light-penetrable layer 54. In other embodiments, step 1340may include providing light source(s) 40 between inlay 36 and housing 34by disposing light source(s) 40 on (e.g., directly on or in a recess on)cavity wall 64, as shown in FIG. 7B.

Method 1300 may further include providing a power source (e.g.,non-rechargeable power source 42 or rechargeable power source 74) anddisposing the power source on or in housing 34 (step 1350). The methodmay further include electronically connecting light source(s) 40 to thepower source (Step 1360) via a bus or other conductor. In someembodiments, the method may further include electronically connectingswitch 68 to light source 40 (Step 1370) (e.g., between light source(s)40 and the power source) for activating and deactivating light source40.

Method 1300 may further include joining housing 34 and inlay 36 at firsthousing surface 46 and the second inlay surface 52 such that lightemitted by light source 40 passes through inlay 30 (Step 1380). Asdescribed above, and with reference to FIGS. 4A-4B, housing 34 and inlay36 may be joined with light source(s) 40 between inlay 36 and housing34, or with light source(s) 40 between light-penetrable layer 54 andbacker layer 56. In some embodiments, and with reference to FIG. 7B,housing 34 and inlay 36 may then be joined with light sources 40 betweeninlay 36 and cavity wall 64 of housing 34. Inlay 36 and housing 34 maybe joined, for example, using an epoxy or other joining method, asdescribed above.

While illustrative embodiments have been described herein, the scopeincludes any and all embodiments having equivalent elements,modifications, omissions, combinations (e.g., of aspects across variousembodiments), adaptations or alterations based on the presentdisclosure. For example, the order of the steps of the above exemplarymethod may be rearranged in any preferred or suitable order, or any stepmay be removed or added.

The elements in the claims are to be interpreted broadly based on thelanguage employed in the claims and not limited to examples described inthe present specification or during the prosecution of the application,which examples are to be construed as non-exclusive. It is intended,therefore, that the specification and examples be considered as exampleonly, with a true scope and spirit being indicated by the followingclaims and their full scope of equivalents.

1-20. (canceled)
 51. A transaction card, comprising: a housing componentcomprising a first housing surface and a second housing surface oppositethe first housing surface, the housing component comprising a cavity,and the cavity comprising a cavity wall; a light source disposed on thecavity wall; and an inlay component comprising: a light-penetrable layerhaving a first light-penetrable surface and a second light-penetrablesurface opposite the first light-penetrable surface; and a backer layerdisposed between the light-penetrable layer and the first housingsurface; wherein the inlay component is joined to the housing componentsuch that the backer layer abuts the first housing surface.
 52. Thetransaction card of claim 51, wherein the housing component and theinlay component are formed of different materials.
 53. The transactioncard of claim 51, wherein visual details are included on an outersurface of the card.
 54. The transaction card of claim 51, furthercomprising a plurality of light sources.
 55. The transaction card ofclaim 51, further comprising a data storage component.
 56. Thetransaction card of claim 55, wherein the data storage component is oneof a microchip, a communication device, a magnetic strip, a barcode, ora Quick Response (QR) code.
 57. The transaction card of claim 51,wherein visual details are included on the light-penetrable layer of theinlay component.
 58. The transaction card of claim 51, wherein visualdetails are included on the backer layer of the inlay component.
 59. Thetransaction card of claim 51, wherein the backer layer and thelight-penetrable layer of the inlay component are formed of differentmaterials.
 60. The transaction card of claim 51, further comprising apower source configured to supply electrical power to the light source.61. The transaction card of claim 60, wherein the power source comprisesa rechargeable power source.
 62. A transaction card, comprising: ahousing component having a first housing surface and a second housingsurface opposite the first housing surface, the housing componentcomprising a cavity, and the cavity comprising a cavity wall; a lightsource disposed on the cavity wall; a switch configured to activate anddeactivate the light source; and an inlay component comprising: alight-penetrable layer having a first light-penetrable surface and asecond light-penetrable surface opposite the first light-penetrablesurface; and a backer layer disposed between the light-penetrable layerand the first housing surface; wherein the inlay component is joined tothe housing component such that the backer layer abuts the first housingsurface.
 63. The transaction card of claim 62, wherein the switch isdisposed between the light-penetrable layer and the backer layer. 64.The transaction card of claim 63, wherein the switch comprises apressure-activated switch.
 65. The transaction card of claim 62, whereinthe switch is positioned adjacent the second light-penetrable surface ofthe inlay component.
 66. The transaction card of claim 65, wherein theswitch comprises a capacitive-type touch sensor.
 67. The transactioncard of claim 62, further comprising a data storage component.
 68. Thetransaction card of claim 67, wherein the data storage component is oneof a microchip, a communication device, a magnetic strip, a barcode, ora Quick Response (QR) code.
 69. The transaction card of claim 62,wherein visual details are included on one or more of thelight-penetrable layer, the backer layer, or an outer surface of thecard.
 70. A method of manufacturing a transaction card, the methodcomprising: forming a housing component having a first housing surface,and a second housing surface opposite the first housing surface, thehousing component comprising a cavity, and the cavity comprising acavity wall; providing a light source disposed on the cavity wall;forming an inlay component comprising: a light-penetrable layer having afirst light-penetrable surface and a second light-penetrable surfaceopposite the first light-penetrable surface, a backer layer disposedbetween the first light-penetrable surface and the first housingsurface; and joining the inlay component to the housing component suchthat the backer layer abuts the first housing surface.